Do's |
Don'ts |
Minimize the amount of heat applied to
the solder pads on the individual boards by using a good
low-temperature solder and low wattage iron. Pretinning the pads
can make soldering of components on the boards quicker and
easier |
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Do not push connecting wires through the holes at each end of the
individual boards so that they protrude out the back side loosen
the Kapton tape backing. Placing wires just into these holes and
gently applying an iron and solder is typically all that is
required for a good connection |
Remember to cut the Kapton tape between
the individual boards before snapping them
apart. A scalpel or single-edged razor blade works well. |
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Do proper
wattage calculations for
resistors to be mounted to ensure component over-heating will
not occur. Kapton tape is thermally viable up to 500ºF
but "hot" temperatures (>300ºF) can cause the adhesive backing to soften somewhat and could
allow the board to detach from its mounted position. |
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Do not remove protective adhesive cover strip and mount
board in final location prior to soldering on components. Even
though soldering times tend to be very short, the high heat
could damage what the board is mounted to (like a plastic
locomotive shell). |
Keep unused boards in a dust-free
container or bag.. The Kapton tape is wider that the boards and
can accumulate dust and dirt along the exposed edges if not
protected. |
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