| Do's | Don'ts | 
			
				| Minimize the amount of heat applied to  
				the solder pads on the individual  boards by using a good 
				low-temperature solder and low wattage iron. Pretinning the pads 
				can make soldering of components on the boards quicker and 
				easier |  | 
			
				|  | Do not push connecting wires through the holes at each end of the 
				individual boards so that they protrude out the back side loosen 
				the Kapton tape backing. Placing wires just into these holes and 
				gently applying an iron and solder is typically all that is 
				required for a good connection | 
			
				| Remember to cut the Kapton tape between 
				the individual boards before snapping them 
				apart. A scalpel or single-edged razor blade works well. |  | 
			
				| Do proper 
				wattage calculations for 
				resistors to be mounted to ensure component over-heating will 
				not occur. Kapton tape is thermally viable up to 500ºF 
				but "hot" temperatures (>300ºF) can cause the adhesive backing to soften somewhat and could 
				allow the board to detach from its mounted position. |  | 
			
				|  | Do not remove protective adhesive cover strip and mount 
				board in final location prior to soldering on components. Even 
				though soldering times tend to be very short, the high heat 
				could damage what the board is mounted to (like a plastic 
				locomotive shell). | 
			
				| Keep unused boards in a dust-free 
				container or bag.. The Kapton tape is wider that the boards and 
				can accumulate dust and dirt along the exposed edges if not 
				protected. |  | 
			
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